PhD Defense: Integration of Conductive Materials and SMD-Components into the FDM Printing Process for Direct Embedding of Electronic Circuits

27 January 2020

Abstract: 3D Printing has been widely adopted as a tool for rapid prototyping and manufacturing of mechanical parts. This work introduces a Fused Deposition Modelling (FDM) 3D printer that combines plastic and conductive materials to build objects with integrated electronics in a single production step.
The core contribution is a combined slicing and design software to support the arrangement and routing of printable 3D circuits.

Monday, 27 January 2020, 11:00, Seminar Room F334, Informatikum, Hamburg

Speaker: Florens Wasserfall, Informatics Dept., Univ. Hamburg